Fast subfloor preparation with Botament
A single primer and a leveling compound allow the subfloor to be perfectly prepared for all types of flooring. It doesn’t matter whether designer or synthetic flooring, carpeting or parquet is to be laid: the processor always has the right product at hand. The putty covers all applications as standard. It becomes a universal genius with three additives – reinforcement fibers, accelerator and quartz sand – or a combination of these. These special products give the installer access to a technology that has been tried and tested for decades. This makes the system solutions not only high-performance, but also particularly safe and fast.
Leveling compound up to 10 mm CT-C25-F5
Leveling compound up to 20 mm CT-C35-F7
Stable leveling compound from 1 to 100 mm CT-C35-F7
Anhydrite leveling compound up to 20 mm CA-C30-F7
Thick layer leveling compound from 3 to 40 mm CT-C35-F7
Fine filler up to 4 mm CT-C25-F10
Botament D1 Speed
Fast, multifunctional adhesive primer
Multifunctional resin 2K
Multifunctional PU quick primer 1K
Botament M53 Extra
Fiber-reinforced leveling compound up to 40 mm CT-C35-F7
Botament MD1 Speed
Flexible waterproofing slurry 1K
Accelerator for balancing masses
Special primer for many indoor applications
Removing old coverings is tedious, costly and time-consuming. Non-water-soluble, old, firmly adhering floor adhesive residues can usually be reworked directly without time-consuming removal or sanding, provided the substrate has been pre-treated with Botament G 140. This 1K PU rapid primer prevents unwanted reactions and plasticizer migration from the old adhesive layers. In addition, it offers a reliable moisture barrier for unheated cement screeds and protection against moisture penetration for sensitive substrates.
Seal cracks – without flexing and staples
With the Botament silicate resins for casting, cracks and joints in indoor and outdoor areas can be repaired quickly and easily will. The time-consuming work steps of flexing and stapling can be dispensed with with this product application.